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Next Generation 6 Layer Enig Communication Board
[Apr 25, 2024]
Specifications: Layers: 6 Thickness:1.6mm Material: FR4 KB6165 Size:80*140mm Surface treatment:OSP Line width/spacing:0.076/0.1mm Minimum aperture: 0.25mm Solder mask color: ...
High Performance 5g Communication Circuit Board
[Apr 25, 2024]
Specifications: Layers: 6 Thickness:1.6mm Material: FR4 KB6165 Size:80*140mm Surface treatment:OSP Line width/spacing:0.076/0.1mm Minimum aperture: 0.25mm Solder mask color: ...
Advanced Wireless Bluetooth Module Circuit Board for Devices Panels
[Apr 25, 2024]
Specifications: Layers: 4 Thickness:0.8mm Material: FR4 KB6165 Size: 22*60mm Surface treatment: Immersion gold Line width/spacing: 4/4mil Minimum aperture: 0.25mm Solder ...
Superior High Frequency Communication Multilayer PCB Board
[Apr 25, 2024]
Specifications: Layers: 6 Thickness:1.6mm Material: FR4 KB6165 Size: 100*90mm Surface treatment:HASL Line width/spacing: 4/4mil Minimum aperture: 0.25mm Solder mask color: ...
High Precision Impedance Multilayer Board with Enhanced Circuit Performance
[Apr 25, 2024]
Specifications: Layers: 4 Thickness:1.2mm Material: FR4 KB6165 Size: 120*36mm Surface treatment: Immersion gold Line width/spacing: 4/4mil Minimum aperture: 0.25mm Solder mask ...
6 Layer High Performance Enig Communication Board
[Apr 25, 2024]
Specifications: Layers: 6 Thickness:1.6mm Material: FR4 KB6165 Size:80*140mm Surface treatment:OSP Line width/spacing:0.076/0.1mm Minimum aperture: 0.25mm Solder mask color: ...
Premium Blue Circuit Board with High-Quality HASL
[Apr 25, 2024]
Specifications: Layers: 2 Thickness:1.6mm Material: FR4 KB6165 Size: 120*60mm Surface treatment: HASL Line width/spacing: 4/4mil Minimum aperture: 0.25mm Solder mask ...
Impedance Multilayer Circuit Board for Enhanced Performance
[Apr 25, 2024]
Specifications: Layers: 4 Thickness:1.2mm Material: FR4 KB6165 Size: 120*36mm Surface treatment: Immersion gold Line width/spacing: 4/4mil Minimum aperture: 0.25mm Solder mask ...
Power Control Circuit Board for Electrical Systems
[Apr 23, 2024]
Specifications: Layers: 2 Thickness: 1.6mm Material: FR4 KB6160 Size: 40*60mm Surface treatment: HASL Line width/spacing: 8/8mil Minimum aperture: 0.25mm Solder mask ...
High-Quality Green Circuit Board for Fragrance Devices
[Apr 23, 2024]
Specifications: Layers: 2 Thickness:1.6mm Material: FR4 KB6165 Size: 33*60mm Surface treatment: ENIG Line width/spacing: 4/4mil Minimum aperture: 0.25mm Solder mask ...
Advanced Multilayer Circuit Board for Digital TV
[Apr 23, 2024]
Specifications: Layers: 4 Thickness:1.6mm Material: FR4 KB6165 Size: 120*80mm Surface treatment: Immersion gold Line width/spacing: 4/4mil Minimum aperture: 0.25mm Solder mask ...
High Performance Multilayer Circuit Board with Impedance
[Apr 23, 2024]
Specifications: Layers: 4 Thickness:1.2mm Material: FR4 KB6165 Size: 120*36mm Surface treatment: Immersion gold Line width/spacing: 4/4mil Minimum aperture: 0.25mm Solder mask ...
Advanced 6 Layer Circuit Board with Gold Plating
[Apr 22, 2024]
Specifications: Layers: 6 Thickness:1.6mm Material: FR4 KB6165 Size: 120*80mm Surface treatment: Immersion gold Line width/spacing: 4/4mil Minimum aperture: 0.25mm Solder mask ...
6 Layer Circuit Board with Gold Plating
[Apr 22, 2024]
Specifications: Layers: 6 Thickness:1.6mm Material: FR4 KB6165 Size: 120*80mm Surface treatment: Immersion gold Line width/spacing: 4/4mil Minimum aperture: 0.25mm Solder mask ...
Microwave Induction Module Board with High-Frequency 5.8g
[Apr 22, 2024]
Specifications: Layers: 4 Thickness:1.2mm Material: FR4 KB6165 Size: 66*121mm Surface treatment: Immersion gold Line width/spacing: 4/4mil Minimum aperture: 0.25mm Solder mask ...
